Singapore – Advanced Substrate Technologies (AST), the joint venture between TOPPAN Holdings Inc. and Broadcom Inc., has opened Singapore’s first facility capable of producing high-end Flip Chip Ball Grid Array (FC-BGA) substrates. The plant targets a persistent bottleneck in AI and networking chip supply.
According to the company, the facility was built through the partnership of Broadcom and TOPPAN, and it is the TOPPAN Group’s first such site outside Japan. AST announced the official opening on 29 September 2026.
Both partners played defined roles in the project. As TOPPAN’s largest customer for FC-BGA substrates, Broadcom closely supported the facility’s development, reflecting the importance of extra substrate capacity to its next-generation AI compute and networking roadmap.
Charlie Kawwas, PhD, President of Broadcom’s Semiconductor Solutions Group, credited the joint effort when describing what the facility offers the chipmaker:
“AST’s FC-BGA substrate capacity in Singapore gives us meaningful flexibility and differentiation as demand for AI and networking silicon continues to climb. This facility, brought online three months early, strengthens our supply chain resilience by delivering vital relief while the industry is constrained by substrate shortages,” said Kawwas.
“Thanks to the exceptional execution by TOPPAN and AST, alongside the continued partnership of the Singapore EDB, this facility will deliver the next generation of large-body, high-layer-count substrates that Broadcom requires to further scale global AI infrastructure,” Kawwas added.
The approximately 95,000-square-metre facility will manufacture large-body, high-layer-count substrates for advanced semiconductor products, including AI compute and networking devices. AST says it is designed to serve growing demand from generative AI and data centres in the region.
The plant also broadens Singapore’s semiconductor ecosystem, which has centred on wafer fabrication, IC design and assembly operations. Demand for advanced substrate capacity continues to outpace global supply, the company said.
Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry (Trade), attended the opening ceremony. AST executives, TOPPAN Group and Broadcom representatives, and other partners and guests also joined the event.
AST Chief Executive Yoshiyuki Iida tied the plant to the supply shortfall and to the commitment of both shareholders:
“AST’s ability to deliver large-body, high-layer-count substrates at TOPPAN’s exacting standard is helping meet a real bottleneck in AI and networking chip production,” said Iida. “We are grateful for the longstanding support and partnership of the Singapore government in this venture. This investment reflects both TOPPAN and Broadcom’s long-term commitment to Singapore as a critical hub in our global manufacturing network and strengthens the resilience of the semiconductor supply chain.”
On the other side, the facility complements its main production hub in Niigata, Japan. Satoshi Oya,TOPPAN President and COO, said:
“Singapore continues to be an attractive destination and gateway to the global semiconductor industry for us, especially with a strong ecosystem of innovation, capabilities and resources,” said Oya. “TOPPAN looks forward to continuing to drive advanced semiconductor packaging forward as artificial intelligence accelerates across the board.”
Singapore’s Economic Development Board (EDB) and JTC Corporation supported the project. According to the release, both agencies played a key role in establishing the facility.
EDB Chairman Png Cheong Boon said the plant strengthens the country’s position in the global semiconductor value chain.“AST’s facility will boost Singapore’s capabilities in advanced substrates, which is a critical enabler for advanced packaging, and strengthen our position in the global semiconductor value chain,” said Boon.
“Singapore has served as an important base for Broadcom and TOPPAN. We are glad that both companies are growing their manufacturing and R&D presence here through AST. EDB will continue to work with both companies and AST to build new capabilities to support global demand for semiconductors, and create new jobs and opportunities here,” Boon added.
JTC Chief Executive Jacqueline Poh pointed to the infrastructure behind the project.
“Advanced substrates are increasingly critical to the semiconductor value chain as AI and high-performance computing drive demand. JTC is pleased to support Broadcom and TOPPAN in establishing this new facility in Jurong and will continue to work with industry partners to provide the infrastructure needed for next generation semiconductor manufacturing in Singapore,” Pooh said
Staffing has already begun. Since breaking ground in March 2024, AST has hired more than 200 high-tech engineers and skilled technicians, in addition to operational personnel in Singapore.
The facility also houses R&D capabilities to meet future performance demands. AST is collaborating closely with technology institutions in Singapore, and the plant includes solar panels and advanced water recycling technologies.
Looking ahead, the facility in the Jurong Lake District is targeting the start of high-value manufacturing by late-2026. Recruitment continues across engineering and technical roles.
AST says it will work closely with TOPPAN and Broadcom to scale output as demand for advanced substrates grows across AI, networking and next-generation computing applications.
