Saudi Arabia – Saudi Arabian AI company HUMAIN has selected Compal Electronics as its long-term strategic original design manufacturer (ODM) partner to develop and manufacture next-generation AI infrastructure and intelligent computing platforms.
The partnership, announced in Riyadh on the 1st of September, will cover cloud AI infrastructure, edge computing, Physical AI, and future intelligent computing technologies. The companies are showcasing their collaboration at LEAP 2026 in Riyadh.
Under the agreement, Compal will provide engineering, manufacturing and supply chain capabilities to support HUMAIN’s AI platform development. The companies said the partnership is intended to support the deployment of AI across data centres, edge environments and physical applications.
“AI is moving from the cloud into everything around us. HUMAIN intends to lead that transition by building the infrastructure, platforms, and intelligent systems that take AI from data centers into the physical world,” said Tareq Amin, CEO of HUMAIN.
“Compal’s engineering depth, manufacturing scale, and broad product portfolio make them an ideal ODM partner,” Amin continued.
The companies will jointly develop AI infrastructure platforms designed to support successive generations of AI servers and computing systems as demand increases. Compal will provide ODM capabilities for AI servers using NVIDIA and AMD accelerated computing technologies, targeting applications including AI training, inference and enterprise workloads.
The partnership will also cover AI PCs and Physical AI applications. HUMAIN and Compal plan to explore AI-enabled personal computing platforms that combine cloud-based and on-device AI for enterprise, government and professional users.
In healthcare, Compal is showcasing its PolyMedX physical AI platform at LEAP 2026. The platform combines edge AI, sensing and automation for applications including hospital operations, patient assistance, clinical workflows and facility management.
The companies said the broader collaboration will combine Compal’s system design, integration, thermal engineering and manufacturing capabilities with HUMAIN’s AI platform development.
“As Compal transforms into an AI-centric company, we are building capabilities from cloud to edge to deliver a full spectrum of AI solutions. Together with HUMAIN, we aim to accelerate AI adoption with scalable platforms ready for real-world deployment,” said Tony Bonadero, CEO of Compal Electronics.
The partnership is being demonstrated at LEAP 2026 through examples of AI infrastructure, edge technologies and Physical AI. The companies are positioning the collaboration as part of a broader effort to connect cloud-based AI capabilities with applications in physical environments.
